Mr. Leckie's experience includes 14 years in all aspects of semiconductor engineering and manufacturing plus 11 years of development and marketing of semiconductor capital equipment. Additionally, Mr. Leckie has been consulting since 1995 on multiple aspects of semiconductor technology and business.

His in-depth specialty is in semiconductor product engineering, test and packaging, however he also has expertise in other areas such as wafer processing, yield management and quality.

Mr. Leckie published industry acclaimed white paper on "Funding the Future: R&D Funding Gap" in October 2005 and has published reports and presented on topics such as Flash and DRAM memory, RFID, etc.  He has participated as a conference chair, session chair, moderator and speaker at numerous conferences.

Mr. Leckie's expert witness experience includes analysis, expert report, deposition and testimony in IP/patent,  tax and breach of contract cases.